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Large panel/seet PCB and mass production
VIA Series system
Large substrate compatible mass production processing apparatus aimed at saving space
VIA series system is the equipment which made desmear and the gold plating preprocessing of a large printed circuit board the main purpose. Correspondence to flexible board is possible by this equipment's combining standard rack cart system and substrate installation jig. Half of footprint including an area necessary to maintenance is below more than equipment before an old PCB series, but excellent composition is achieved in the maintenance very much. This system is equipped with a touch panel PC of Windows base in operation. With the ModVIA series, the processing area can be selected according to the production volume.
Specification / models | MaxVIA | ModVIA | ProVIA |
---|---|---|---|
Footprint | 1652W×2445H×1747D(mm) | 1652W×2445H×1747D(mm) | 1652W×2445H×1747D(mm) |
Enable processing area
(Per cell) |
1118D×610H(mm) | 1118D×610H(mm) | 762D×610H(mm) |
The number of processing cell | 13 | 3,5,8 | 13 |
RF power | 10kW | 5kW | 5kW/10kW |
Gas control MFC | Standard:3(Maximum Number of MFCs:5) | ||
Control System | PLC, touch screen interface | ||
Vacuum pump | Dry pump / mechanical booster pump (built into the device housing) | ||
Equipment weight | 2330kg | 1776kg | 1776kg |